Zig-zag in-line package

Zig-zag in-line package

Zig-zag in-line package o "ZIP" es una forma de encapsulado para circuitos integrados, que se caracteriza por disponer de una serie de pines que se alternan para formar 2 filas separadas en zig zag, con unas medidas aproximadas de 3 mm x 30 mm x 10 mm.


  • Chips tipo ZIP en sus zócalos

  • Chips ZIP

  • Encapsulado ZIP

Son comunmente vistos para aplicaciones de potencia, en los que el circuito integrado puede alcanzar elevadas temperaturas. Presentan una o varias perforaciones practicadas sobre el cuerpo de la pastilla del encapsulado, para permitir su acoplamiento con tornillos a disipadores verticales, o sobre la cara interior de las carcasas.

Ejemplos de IC's en ZIP son controladores y convertidores de señal en televisores de tubo, controladores de motores paso a paso, amplificadores de audio, etcétera. Particularmente para chips de memorias RAM dinámicas en ordenadores, no resultó ser popular; se esperaba que reemplazase a los Dual in-line package (DIP), pero fueron reemplazados muy rápidamente por los TSOP de las memorias SIMM y DIMM.


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